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analysistech 導(dǎo)熱膏導(dǎo)熱硅脂熱阻測量分析系統(tǒng)

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聯(lián)系方式：周先生查看聯(lián)系方式

更新時(shí)間：2018-01-17 19:47:52瀏覽次數(shù)：797次

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商鋪產(chǎn)品：93條

所在地區(qū)：上海上海市

聯(lián)系人：周先生 （經(jīng)理）

產(chǎn)品簡介

analysistech 熱阻測量分析儀，美國 Analysis tech inc公司生產(chǎn)

詳細(xì)介紹

The Analysis Tech Phase 12 Thermal Analyzer provides comprehensive automated control of semiconductor thermal measurements for production and development testing with powerful features such as:

All Test Modes:

?Testing all devices: diodes, LEDs, bipolar, MOSFET, IGBT, functional IC, thryistors, test dies
?Full 3-terminal and 2-terminal test modes for MOSFETs, IGBTs, bipolars
?Automated high speed data collection, reduction, and analysis for transient and steady state data
?Transient RC models generated directly from measured junction temperature heating/cooling
?Compatible with all 750E Mil Stds and JEDEC 51 Series methods
?Rjc measurement with JEDEC 51-14 transient method
?Transient data plots for all test parameters in all tests modes
?Simple, automated instrument-calibration procedures
?Multiple text and graphics file formats for convenient exporting
?Continuous inligent monitoring for errors and data validity
?Kelvin (4-wire) connections to eliminate test cable resistances effects
?Selection of automatic power-control by current, wattage, and ΔTj
?Standard and custom test fixturing available
?Windows 7 operating system


Steady State Thermal Resistance Mode: 

?Multi-junction temperature sensing capability for ICs & multi-die devices
?User-selectable thermal equilibrium criteria
?Batch-mode for determining power level and air flow effects
?Control of accessory laboratory equipment for integrated testing
?Capability for automatically switching the device under test


Die Attach or Power Pulse Mode: 

?High speed thermal evaluation with test duration less than 1 second
?Pass/Fail or bin sorting based on die-attach quality
?Data plots of all parameters including die-attach histogram
?Extended-life testing with interspersed die-attach testing
?Interface for mechanized device handlers
?Batch mode die-attachment production testing multi-chip modules


Heating Characterization / Transient Thermal Impedance Mode:

?Heating and cooling curve time-resolution: 1 microsecond
?Heating and cooling curve span: 1 microsecond - 1000 seconds
?Rjc measurement with JEDEC 51-14 dual transient method
?Utilizes structure function analysis, cumulative and differential
?Produces high-order RC models and optimized compact dynamic RC models in Cauer and Foster topologies


Comparison of Phase 11 to Phase 12 Thermal Analyzers:

?1 Megahertz sampling rate versus 333 Kilohertz
?Compatible with all existing Analysis Tech fixturing.
?Enhanced WinTherm Software for Shorter Test Durations
?Improved Signal-to-Noise Ratio 
?Self-installation WinTherm CD 

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