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德國(guó)ASM SIPLACED2貼片機(jī)

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產(chǎn)品簡(jiǎn)介:
Fast and flexible dual

gantry machine

High-tech with an optimumprice/performance ratio:

this was the SIPLACE team'saim for the SIPLACE D2 – the fast and flexible dual-gantrymachine from the new SIPLACE D-series generation.

Now you can benefitfrom the innovative addedvalue that the SIPLACE D2 creates with its combinationof innovative and proventechnology.

The highlights of theSIPLACE D2 at a glance:

Flexible head combinations to meet every need The SIPLACE D2 isequipped with two gantries for high speed and flexibility.

Their head modularity allows you to choose between the 6 and 12-nozzle Collect& Place heads. This ensures that you always have the optimum configuration for individual requirements.

During placement, the placement heads fetch the components from the at-rest component supply, and set them down on the PCB, which is also stationary.

This proven SIPLACE principle guarantees reliable pickup of even the smallest components, prevents the components slipping on the PCB and minimizes traversing paths.

Optimized transport conditions with the flexible dual conveyor The user also has access to different variants of the PCB conveyor: SIPLACE single conveyor and flexible SIPLACE dual conveyor.

The latter offers all the benefits of the conventional dual conveyor, such as reducing non-productive downtimes, combined with the option of using the single conveyor.

01005 placement

Even the trend towards component miniaturization is no problem for the SIPLACE D2 since it is equipped as standard to place 01005 components.

To do this, you simply have to implement the optional 01005 package for 12-nozzle Collect&Place heads. You can then process even the tiniest components currently available without any problems.

參數(shù)特點(diǎn):
Placement ratea
IPC value
Benchmark value
Theoretical value
a) See page 7 for a definition of the output values
27,200 comp./h
31,000 comp./h
40,500 comp./h
Component range 01005 - 27 x 27 mm2
Placement accuracyb/
angular accuracy
b) The accuracy value was measured using the vendor-neutral IPC standard
± 50 μm (3?), ± 67 μm (4?)
± 0.225° (3?), ± 0.3° (4?)
Feeder module types Tape feeder modules, stick magazine feeders, bulk
cases, dip modules, application-specific OEM feeder
modules
Feeding capacity 90 tracks with 3 x 8 mm S
PCB format max. 610 x 508 mm2
PCB thickness 0.3 - 4.5 mm (others available on request)
PCB weight max. 3 kg
Camera 5 illumination levels